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Design Guidelines and Manufacturing Capabilities

Listed below is a detailed list of our capabilites and design guildelines. Keeping your designs within our standard and advanced capabilities will yield the most competitive pricing. Our emerging technology capabilities support the most advanced PCB designs and  we recommend having a DFM completed by Streamline Circuit's pre-engineering team.

To jump to a specific section, use the links below.

  Laminate Materials  | Lines, Spaces, & Pad Diameters | Electroplating | Conductor Finishes 

Lead Free Finishes  | Tolerances  | Via Capabilies | Soldermask and Legend

 


 

Standard

Advanced

Emerging

Panel Size

18" X 24" & 19" X 25"

20" X 26" & 24" X 30"

  20" X 26" & 24" X 30"

Layer Count

2 to 36

48+

60+

Laminate Material

      

FR4 Tg 140

Yes

Yes

Yes

FR4 Tg 170

Yes

Yes

Yes

GETEK

Yes

Yes

Yes

Rogers

Yes

Yes

Yes

Polyimide

Yes

Yes

Yes

Duroid

Yes

Yes

Yes

RoHs Materials

Yes

Yes

Yes

Polyclad 370 HR

Yes

Yes

Yes

Isola 410

Yes

Yes

Yes

TUC

Yes

Yes

Yes

Halogen Free

Yes

Yes

Yes

Stablcor

 Yes Yes Yes

Exotic Material Types

Yes

35+

40+

Finished Thickness [Multilayer]

.005" to .220"

.220"-.250"

Greater than .250"

Minimum Core Thickness

.002"

.002"

.001"

Finished Thickness Tolerance [+/-]

10%

7%

5%

Multiple Laminations

5

9

12+

Copper Foil Weights Internal

1/4 to 2

up to 4 ounce

up to 4 ounce

Copper Foil Weights External

1/4 to 3

up to 4 ounce

>6 ounce

Lines, Spaces & Pad Diameters

      

Internal Line Width

.0035"

.002”

<.002"

Internal Spacing

.0035"

.002"

<.002"

External Line Width

.0035"

.002"

<.002"

External Spacing

.0035"

.002"

<.002"

Int. Pad Size-A/R Per Side (Fin.-.001)

.005"

.004"

<.004"

Ext. Pad Size-A/R Per Side (Fin.-.002)

.003"

.003"

<.003"

SMT Pitch

.010"

.010"

<.010"

Impedance

10%

5%

>5%

Electroplating

      

Tin Lead Plating Thickness

.0003"-.0005"

>.0005"

>.0005"

Tin Nickel Plating Thickness

150 Microinches

250 Microinches

>250 Microinches

Low Stress Nickel

100 Microinches

250 Microinches

>250 Microinches

Gold Plating Thickness

30 Microinches

As Specified

As Specified

Minimum Drilled Hole Size

0.012

.0098"

Less than .0059"

Hole Aspect Ratio

10 to 1

15 to 1

<20 to 1

Conductor Finishes

      

HASL

Yes

Yes

Yes

Solder with Reflow

Yes

Yes

Yes

White Tin

Yes

Yes

Yes

Carbon Ink

Yes

Yes

Yes

Lead Free Finishes

      

Electroless Nickel/ Paladium/ Gold

 Yes Yes Yes

Electroless Nickel/Immersion Gold

Yes

Yes

Yes

Immersion Gold

Yes

Yes

Yes

Immersion Silver

Yes

Yes

 Yes

Entek 106A HT

Yes

Yes

Yes

HASL

Yes

Yes

Yes

Tolerances

  

 

 

Drilled Hole To Copper

.008"

.007"

.006"

Plated Hole Tolerances [+/-]

.002"

.001"

Less than .001"

Non Plated Hole Tolerances [+/-]

.001"

.001"

<.001"

Fabrication Tolerances [+/-]

.005"

.003"

<.003"

Via Capabilities

 

 

 

Laser Micro Vias 

.004"

.002"

<.002"

Blind / Buried Vias

.004"

.002"

<.002"

Via Under PAD

Yes

Yes

Yes

Castellation

Yes

Yes

Yes

Laser Drill

.004

.002

Less than .002

MechanicalVias

.0059

.0047

Less than .0047

Tented LPI

Coated With LPI

Coated/plugged

Coated/plugged

Plugged UV Curable [no solvent]

Maximum .020"

Yes

Yes

Silver Conductive Via Fill

Yes

Yes

Yes

Non-Conductive Via Fill

Yes

Yes

Yes

Soldermask and Legend

      

Minimum Mask Clearance [LPI]

.003"

.002"

Less than .002"

Minimum Soldermask Thickness

0.0004"

0.0004"

0.0004"

Gasketed Chip Scale Packaging

 .002" .001" Less than .001"

Soldermask Type

LPI

Dry Film

As required

Soldermask Color

Green

Any Color

Any Color

Soldermask Web Minimum

.004"

.003"

Less than .003"

Legend Color

White

Any Color

Any Color

Legend Feature Size

.008"wide x.030" high

.006" wide x .03" High Min

LPI Legend .003" x .02"

Flatness (Symmetrical construction)

IPC Standard

Review Required

Review Required

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