Streamline Circuits |
Standard |
Advanced |
Emerging |
Panel Size |
18" X 24"
& 19" X 25" |
20" X 26"
& 24" X 30" |
|
Layer Count |
2 to 36 |
36+ |
50+ |
Laminate Material |
|
|
|
FR4 Tg 140 |
Yes |
Yes |
Yes |
FR4 Tg 170 |
Yes |
Yes |
Yes |
GETEK |
Yes |
Yes |
Yes |
Rogers |
Yes |
Yes |
Yes |
Polyimide |
Yes |
Yes |
Yes |
Duroid |
Yes |
Yes |
Yes |
RoHs Materials |
Yes |
Yes |
Yes |
Polyclad 370 HR |
Yes |
Yes |
Yes |
IS 410 |
Yes |
Yes |
Yes |
TUC |
Yes |
Yes |
Yes |
Halogen Free |
Yes |
Yes |
Yes |
| Exotic Material Types |
|
|
|
Finished Thickness
Tolerances |
.005" to
.250" |
>.250" |
See Advanced |
Finished Thickness
[Multilayer] |
.008" to
.220" |
.220"-.350" |
Greater than .300" |
Minimum Core Thickness |
.003" |
.002" |
.002" |
Finished Thickness
Tolerance [+/-] |
10% |
7% |
5% |
Multiple Laminations |
5 |
8 |
8+ |
Copper Foil Weights
Internal |
1/4 to 1/2 |
.<02 oz. |
.<05 oz. |
Copper Foil Weights
External |
1/4 to 3 |
4 to 5 ounce |
Up to 6 Oz. |
Lines, Spaces & Pad Diameters |
|
|
|
Internal Line Width |
.0045" |
.002” |
Less than .003" |
Internal Spacing |
.005" |
.002" |
Less than .003" |
External Line Width |
.004" |
.002" |
Less than .003" |
External Spacing |
.004" |
.002" |
Less than .003" |
Int. Pad Size-A/R Per
Side (Fin.-.001) |
.005" |
.004" |
Less than .004" |
Ext. Pad Size-A/R Per
Side (Fin.-.002) |
.003" |
.003" |
Less than .003" |
SMT Pitch |
.0.10" |
.010" |
Less than .010" |
Impedance |
10% |
2.5% |
2-2.5% |
Electroplating |
|
|
|
Tin Lead Plating
Thickness |
Copper Coverage |
.003-.0015 |
<.0015 |
Tin Nickel Plating
Thickness |
150 Microinches |
250 Microinches |
Greater than 250 Microinches |
Low Stress Nickel |
100 Microinches |
250 Microinches |
Greater than 250 Microinches |
Gold Plating Thickness |
30 Microinches |
As Specified |
As Specified |
Minimum Drilled Hole
Size |
0.012 |
.0098" |
Less than .0098" |
Hole Aspect Ratio |
10 to 1 |
15 to 1 |
20 to 1 |
Conductor Finishes |
|
|
|
HASL |
Yes |
Yes |
Yes |
Solder with Reflow |
Yes |
Yes |
Yes |
White Tin |
Yes |
Yes |
Yes |
Carbon Ink |
Yes |
Yes |
Yes |
| Lead Free |
|
|
|
Electroless Nickel |
Yes |
Yes |
Yes |
Immersion
Gold |
Yes |
Yes |
Yes |
Immersion Silver |
Yes |
Yes |
Yes |
Entek 106A HT |
Yes |
Yes |
Yes |
HASL |
Yes |
Yes |
Yes |
Tolerances |
|
|
|
Drilled Hole To Copper
|
.008" |
.005" |
Less than .005" |
Plated Hole Tolerances
[+/-] |
.003" |
.002" |
Less than .002" |
Non Plated Hole
Tolerances [+/-] |
.001" |
.001" |
Less than .001" |
Fabrication Tolerances
[+/-] |
.005" |
.003" |
Less than .003" |
Via Hole Finish |
|
|
|
Laser Micro Vias |
.004 |
.003 |
<.003 |
Blind / Buried Vias |
.004 |
.003 |
<.003 |
Via Under PAD |
Yes |
Yes |
Yes |
Castellation |
Yes |
Yes |
Yes |
Laser Drill |
.004 |
.003 |
Less than .003 |
MechanicalVias |
.0059 |
.0047 |
Less than .0047 |
Tented LPI |
Coated With LPI |
Coated/plugged |
Coated/plugged |
Plugged UV Curable [no
solvent] |
Maximum .020" |
Yes |
Yes |
Silver Conductive Via
Fill |
Yes |
Yes |
Yes |
Silver Non-Conductive
Via Fill |
Yes |
Yes |
Yes |
Soldermask and Legend |
|
|
|
Minimum Mask Clearance
[LPI] |
.003" |
.0025" |
Less than .002" |
Minimum Soldermask Thickness |
0.0004 |
0.0004 |
0.0004 |
Soldermask Type |
LPI |
Dry Film |
N/A |
Soldermask Color |
Green |
Any Color |
N/A |
Soldermask Web Minimum |
.004" |
.003" |
Less than .003" |
Legend Color |
White |
Any Color |
N/A |
Legend Feature Size |
.008" Wide X
.030" High Min. |
.006" Wide X
.030" High Min. |
N/A |
Flatness (Symmetrical
construction) |
IPC Standard |
IPC Standard |
IPC Standard |
|
|
|
|
