Streamline Circuits |
Standard |
Advanced |
Emerging |
Panel Size |
18" X 24"
& 19" X 25" |
20" X 26"
& 24" X 30" |
|
Layer Count |
2 to 36 |
48+ |
60+ |
Laminate Material |
|
|
|
FR4 Tg 140 |
Yes |
Yes |
Yes |
FR4 Tg 170 |
Yes |
Yes |
Yes |
GETEK |
Yes |
Yes |
Yes |
Rogers |
Yes |
Yes |
Yes |
Polyimide |
Yes |
Yes |
Yes |
Duroid |
Yes |
Yes |
Yes |
RoHs Materials |
Yes |
Yes |
Yes |
Polyclad 370 HR |
Yes |
Yes |
Yes |
Isola 410 |
Yes |
Yes |
Yes |
TUC |
Yes |
Yes |
Yes |
Halogen Free |
Yes |
Yes |
Yes |
| Exotic Material Types |
Yes |
35+
|
40+
|
Finished Thickness
[Multilayer] |
.005" to
.220" |
.220"-.250" |
Greater than .250" |
Minimum Core Thickness |
.002" |
.002" |
.001" |
Finished Thickness
Tolerance [+/-] |
10% |
7% |
5% |
Multiple Laminations |
5 |
9 |
12+ |
Copper Foil Weights
Internal |
1/4 to 2 |
up to 4 ounce |
up to 4 ounce |
Copper Foil Weights
External |
1/4 to 3 |
up to 4 ounce |
>6 ounce |
Lines, Spaces & Pad Diameters |
|
|
|
Internal Line Width |
.0035" |
.002” |
<.002" |
Internal Spacing |
.0035" |
.002" |
<.002" |
External Line Width |
.0035" |
.002" |
<.002" |
External Spacing |
.0035" |
.002" |
<.002" |
Int. Pad Size-A/R Per
Side (Fin.-.001) |
.005" |
.004" |
<.004" |
Ext. Pad Size-A/R Per Side (Fin.-.002) |
.003" |
.003" |
<.003" |
SMT Pitch |
.010" |
.010" |
<.010" |
Impedance |
10% |
5% |
>5% |
Electroplating |
|
|
|
Tin Lead Plating
Thickness |
.0003"-.0005" |
>.0005" |
>.0005" |
Tin Nickel Plating
Thickness |
150 Microinches |
250 Microinches |
>250 Microinches |
Low Stress Nickel |
100 Microinches |
250 Microinches |
>250 Microinches |
Gold Plating Thickness |
30 Microinches |
As Specified |
As Specified |
Minimum Drilled Hole
Size |
0.012 |
.0098" |
Less than .0059" |
Hole Aspect Ratio |
10 to 1 |
15 to 1 |
<20 to 1 |
Conductor Finishes |
|
|
|
HASL |
Yes |
Yes |
Yes |
Solder with Reflow |
Yes |
Yes |
Yes |
White Tin |
Yes |
Yes |
Yes |
Carbon Ink |
Yes |
Yes |
Yes |
| Lead Free Finishes |
|
|
|
Electroless Nickel/Immersion Gold |
Yes |
Yes |
Yes |
Immersion
Gold |
Yes |
Yes |
Yes |
Immersion Silver |
Yes |
Yes |
Yes |
Entek 106A HT |
Yes |
Yes |
Yes |
HASL |
Yes |
Yes |
Yes |
Tolerances |
|
|
|
Drilled Hole To Copper
|
.008" |
.007" |
.006" |
Plated Hole Tolerances
[+/-] |
.002" |
.001" |
Less than .001" |
Non Plated Hole
Tolerances [+/-] |
.001" |
.001" |
<.001" |
Fabrication Tolerances
[+/-] |
.005" |
.003" |
<.003" |
Via Hole Finish |
|
|
|
Laser Micro Vias |
.004" |
.002" |
<.002" |
Blind / Buried Vias |
.004" |
.002" |
<.002" |
Via Under PAD |
Yes |
Yes |
Yes |
Castellation |
Yes |
Yes |
Yes |
Laser Drill |
.004 |
.002 |
Less than .002 |
MechanicalVias |
.0059 |
.0047 |
Less than .0047 |
Tented LPI |
Coated With LPI |
Coated/plugged |
Coated/plugged |
Plugged UV Curable [no
solvent] |
Maximum .020" |
Yes |
Yes |
Silver Conductive Via
Fill |
Yes |
Yes |
Yes |
Non-Conductive
Via Fill |
Yes |
Yes |
Yes |
Soldermask and Legend |
|
|
|
Minimum Mask Clearance
[LPI] |
.003" |
.002" |
Less than .002" |
Minimum Soldermask Thickness |
0.0004" |
0.0004" |
0.0004" |
Soldermask Type |
LPI |
Dry Film |
As required |
Soldermask Color |
Green |
Any Color |
Any Color |
Soldermask Web Minimum |
.004" |
.003" |
Less than .003" |
Legend Color |
White |
Any Color |
Any Color |
Legend Feature Size |
.008"wide x.030" high |
.006" wide x .03" High Min |
LPI Legend .003" x .02" |
Flatness (Symmetrical construction) |
IPC Standard | Review Required | Review Required |
